PRE2019 3 Group4 Design Flaws and Future Improvements: Difference between revisions
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===Inner Walls Casing=== | ===Inner Walls Casing=== | ||
The 3D printing process did not go completely according to plan. This is partly due to bad communication with the 3D printing contact and partly due to 3D printer failures. From the 3D printing contact it became clear that in the final design inner walls had to be added for increased stability. By adding these inner walls, such that the power supply would be on the left side of the | The 3D printing process did not go completely according to plan. This is partly due to bad communication with the 3D printing contact and partly due to 3D printer failures. From the 3D printing contact it became clear that in the final design inner walls had to be added for increased stability. By adding these inner walls, such that the power supply would be on the left side of the casing, followed by the two PCBs that control the solenoids in the middle, followed by the RPi on the right of the casing, these parts would be kept separated from each other. | ||
It followed that indeed the stability for the | It followed that indeed the stability for the casing increased. However in the 3D printing process something went wrong due to which the inner walls had been printed twice, thus encompassing twice the space in the casing. This posed problems with the placement of the two PCBs in the middle, since these did not fit anymore in the desired location. Eventually the decision had been made to place one PCB on the left side (on top of the power supply) and one PCB on the right side of the casing. | ||
===Space Casing=== | ===Space Casing=== | ||
Revision as of 11:09, 28 March 2020
On this separate wiki page the design flaws that arose during the assembly of the electronics in the casing will be described. Also, if applicable, a solution is given to a design flaw such that this may be prevented in the future.
Micro USB cable hole
On the right side of the design casing a cutout is placed for the entry of the micro USB cable for the RaspberryPi (RPi). The hole has been created according to the standard dimensions of a micro USB plug, however the casing of the micro USB itself had not been taken into account. This posed problems, since the micro USB is now too large to enter the design casing.
As a solution to this problem the RPi has been moved outside of the design casing for the final design and tests. Luckily this could be done easily due to the availability of the RPi extension kit with a large ribbon cable. Therefore for the future it is important to also take into account the casing of the micro USB itself when creating a cutout for the micro USB.
Inner Walls Casing
The 3D printing process did not go completely according to plan. This is partly due to bad communication with the 3D printing contact and partly due to 3D printer failures. From the 3D printing contact it became clear that in the final design inner walls had to be added for increased stability. By adding these inner walls, such that the power supply would be on the left side of the casing, followed by the two PCBs that control the solenoids in the middle, followed by the RPi on the right of the casing, these parts would be kept separated from each other.
It followed that indeed the stability for the casing increased. However in the 3D printing process something went wrong due to which the inner walls had been printed twice, thus encompassing twice the space in the casing. This posed problems with the placement of the two PCBs in the middle, since these did not fit anymore in the desired location. Eventually the decision had been made to place one PCB on the left side (on top of the power supply) and one PCB on the right side of the casing.
Space Casing
When manufacturing the final design, problems quickly arose with respect to the space of the casing. During the design process of the casing, the space had already been increased once before the final casing was 3D printed. However with the RPi extension kit PCB not assigned to any particular location in the casing, it was hard to place this PCB on a proper location.
Ultimately, with the decision to remove the RPi from the casing for the final design and tests, more space was available in the casing. By taking proper use of this available space, the RPi extension kit PCB could be implemented in the casing. Regarding the future, a larger casing would not be needed if the PCBs would be designed and manufactured with surface mount (SMD) components. This would significantly decrease the amount of space needed inside the casing, and could probably even decrease the casing dimensions.